TSMC Revenue Hits Record as GlobalFoundries Signs $2 Billion U.S. AI-Chip Deal

Close-up of a circuit board, used as a contextual image for semiconductor manufacturing. Photo by Alexandre Debiève on Unsplash.

October 8, 2026 — Taiwan Semiconductor Manufacturing Co. reported record third-quarter revenue on Thursday as fellow chipmaker GlobalFoundries announced a five-year, $2 billion agreement to make a crucial advanced-packaging component for TSMC in New York.

The developments underscore demand for artificial-intelligence computing and efforts to diversify the supply chain, although the proposed U.S. production expansion is still years away.

TSMC sales surge

TSMC said September consolidated revenue reached approximately NT$511.86 billion, up 54.6% from a year earlier but down 0.6% from August. Revenue for the first nine months totaled NT$3.90 trillion, a 41.1% year-over-year increase.

Reuters calculated third-quarter sales of approximately NT$1.49 trillion, or $46.7 billion, up about 50% from a year earlier and above analysts’ NT$1.46 trillion estimate. TSMC is scheduled to report full quarterly earnings and updated guidance on October 15.

ZARK NEWS | SEMICONDUCTOR BRIEF

TSMC THIRD-QUARTER REVENUE

NT$1.49 trillion
About +50% year over year

September sales: NT$511.86 billion | +54.6% year over year

Original Zark News graphic. Data: TSMC; third-quarter calculation: Reuters. Revenue is not profit.

Original Zark News data graphic showing reported September sales and Reuters-calculated third-quarter revenue. No documentary footage or company photograph is depicted.

U.S. advanced-packaging supply agreement

Separately, GlobalFoundries said it signed a five-year, $2 billion manufacturing agreement to supply silicon interposers for TSMC’s CoWoS advanced-packaging system. GlobalFoundries expects to expand capacity at its Malta, New York, plant and establish what it describes as the first U.S.-based source of silicon interposers for this advanced-packaging ecosystem.

Interposers help connect computing processors and high-bandwidth memory within advanced chip packages, making them important to powerful AI systems. GlobalFoundries expects volume production to begin ramping in the first half of 2028. That schedule is a projection, not production already underway.

The two announcements are related to the broader AI semiconductor supply chain, but GlobalFoundries’ new agreement did not cause TSMC’s already-reported revenue increase.

What investors are watching

TSMC’s October 15 earnings call should provide more detail about margins, capacity and demand. Investors will also watch whether GlobalFoundries meets its planned 2028 ramp and how much advanced-packaging capacity the arrangement ultimately adds. These outcomes remain uncertain.

Sources

TSMC September 2026 revenue release | GlobalFoundries October 8 announcement | Reuters TSMC revenue reporting | Reuters GlobalFoundries reporting

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